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LED packaging for lighting applications design, manufacturing, and testing /

"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--

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Bibliographic Details
Main Authors: Liu, S. Sheng, 1963
Group Author: Luo, Xiaobing, 1974
Published:
Literature type: Electronic eBook
Language: English
Subjects:
Light emitting diodes > Design and construction
Light emitting diodes > Computer simulation
Electronic packaging
Electric lighting > Equipment and supplies
TECHNOLOGY & ENGINEERING > Electronics > Circuits > General
TECHNOLOGY & ENGINEERING > Electronics > Semiconductors
TECHNOLOGY & ENGINEERING > Electronics > Solid State
Electronic books
Online Access: http://onlinelibrary.wiley.com/book/10.1002/9780470827857
Summary: "This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--
Carrier Form: 1 online resource (xxi, 352 pages) : illustrations
Bibliography: Includes bibliographical references and index.
ISBN: 9780470827857 (electronic bk.)
0470827858 (electronic bk.)
9780470827840 (electronic bk.)
047082784X (electronic bk.)
0470828404
9780470828403
1118082958
9781118082959
Index Number: TK7871
CLC: TN312
Contents: Front Matter -- Introduction -- Fundamentals and Development Trends of High Power LED Packaging -- Optical Design of High Power LED Packaging Module -- Thermal Management of High Power LED Packaging Module -- Reliability Engineering of High Power LED Packaging -- Design of LED Packaging Applications -- LED Measurement and Standards -- Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance -- Index.

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