胶接结构与复合材料的无损检测

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Bibliographic Details
Main Authors: 陈积懋 (编著); 余南廷 (编著)
Published: 国防工业出版社
Publisher Address: 北京
Publication Dates: 1984
Literature type: Book
Language: Chinese
Series: 无损检测技术丛书
Subjects:
Carrier Form: 155页: ; 19cm
Index Number: TB303
CLC: TB303
TB330.25
Call Number: TB303/7224