Screen LibraryDesign of 3D integrated circuits and systems /
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| Group Author: | ; |
|---|---|
| Published: |
CRC Press/Taylor & Francis Group,
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| Publisher Address: | Boca Raton, FL : |
| Publication Dates: | [2015] |
| Literature type: | Book |
| Language: | English |
| Series: |
Devices, circuits, and systems
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| Subjects: | |
| Carrier Form: | xx, 304 pages : illustrations ; 24 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: |
9781466589407 (hardback) : 146658940X |
| Index Number: | TK7874 |
| CLC: | TN492 |
| Call Number: | TN492/D457 |
| Contents: | 1. 3D integration technology with TSV and IMC bonding / Katsuyuki Sakuma -- 2. Wafer-level three-dimensional ICs for advanced CMOS integration / Ronald J. Gutmann and Jian-Qiang Lu -- 3. Integration of graphics processing cores with microprocessors / Deepak C. Sekar and Chinnakrishnan Ballapuram -- 4. Electrothermal simulation of three-dimensional integrated circuits / Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis -- 5. Thermal management in 3D ICs/systems / Francesco Zanini -- 6. Emerging interconnect technologies for 3D networks-on-chip / Rohit Shar |