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1

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Electromigration Inside Logic Cells : Modeling, Analyzing and Mitigating Signal Electromigration in NanoCMOS /

Main Authors: Posser, Gracieli (Author)
Corporate Authors: SpringerLink (Online service)
Group Author: Sapatnekar, Sachin S; Reis, Ricardo
Published: Springer International Publishing : Imprint: Springer,
Publication Dates: 2017.

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2

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Mitigating process variability and soft errors at circuit-level for FinFETs /

Main Authors: Zimpeck, Alexandra
Group Author: Meinhardt, Cristina; Artola, Laurent; Reis, Ricardo A. L. (Ricardo Augusto da Luz)
Published: Springer,
Publication Dates: [2021]
Call Number: TN386.02/Z76

Book

3

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VLSI-SoC design trends : 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6-9, 2020 : revised and extended selected papers /

Corporate Authors: IFIP/IEEE International Conference on Very Large Scale Integration Online)
Group Author: Calimera, Andrea; Gaillardon, Pierre-Emmanuel; Korgaonkar, Kunal; Kvatinsky, Shahar; Reis, Ricardo A. L. (Ricardo Augusto da Luz)
Published: Springer,
Publication Dates: [2021]
Call Number: TN47-532/I615/2020

Book

4

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1st International Conference on Engineering Manufacture 2022 : selected contributions of EM 2022 /

Corporate Authors: International Conference on Engineering Manufacture Porto, Portugal)
Group Author: Silva, Lucas Filipe Martins da, 1973-; Kumar, D. Ravi; Reis Vaz, Maria de Fátima; Carbas, Ricardo J. C.
Published: Springer,
Publication Dates: [2022]
Call Number: TH16-532/I613-30/2022

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5

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VLSI-SoC - technology advancement on SoC design : 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, Singapore, October 4-8, 2021, revised and extended selected papers /

Corporate Authors: IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration Singapore)
Group Author: Grimblatt, Victor (Editor); Chang, Chip-Hong (Editor); Reis, Ricardo (Editor); Chattopadhyay, Anupam (Professor of computer science) (Editor); Calimera, Andrea (Editor)
Published: Springer,
Publication Dates: [2022]
Call Number: TN47-532/I615/2021

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