管好技术债：低摩擦软件开发之道 = Managing technical debt：reducing friction in software development

Main Authors: (加) 克鲁奇顿 Kruchten, Philippe (著); (美) 诺德 Nord, Robert (著); (美) 厄兹卡亚 Ozkaya, Ipek (著)
Group Author: 冯文辉 (译)
Published: 电子工业出版社
Publication Dates: 2023
Call Number: TP311.52/4224-8