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次世代パワー半導体デバイス·実装技術の基礎 Siから新材料への新展開

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Main Authors: 田中保宣 (田中保宣監修)
Published: 科学情報出版
Publication Dates: 2021.1
Call Number: WJTN303/6452
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半導体·電子機器の熱設計と解析 初めて学ぶ熱対策と設計法

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Main Authors: 石塚勝 1953- (石塚勝著)
Published: 科学情報出版
Publication Dates: 2015.3
Call Number: WJTN301/1647
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