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1
LED封装与检测技术

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Main Authors: 陈慧挺 (陈慧挺，吴姚莎主编); 吴姚莎
Published: 机械工业出版社
Publication Dates: 2022
Call Number: TN383.059.4/7255
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2
高密度集成电路有机封装材料

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Main Authors: 杨士勇 (杨士勇编著)
Published: 电子工业出版社
Publication Dates: 2022
Call Number: TN405/4941
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3
集成电路高可靠封装技术

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Main Authors: 赵鹤然 (赵鹤然主编)
Published: 机械工业出版社
Publication Dates: 2022
Call Number: TN405/4842
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4
集成电路先进封装工艺 Cu-Cu键合技术 Cu-Cu bonding technology

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Main Authors: 史铁林 (1964-) (史铁林[等]著)
Published: 高等教育出版社
Publication Dates: 2022
Call Number: TN405/5084
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5
功率半导体器件封装技术

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Main Authors: 朱正宇 (朱正宇[等]编著); 王可; 蔡志匡; 肖广源
Published: 机械工业出版社
Publication Dates: 2022
Call Number: TN305.94/2913
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6
“芯”想事成 集成电路的封装与测试

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Main Authors: 刘子玉 (刘子玉著)
Published: 上海科学普及出版社
Publication Dates: 2022
Call Number: TN405-49/0411
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7
硅通孔三维封装技术

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Main Authors: 于大全 (于大全主编)
Published: 电子工业出版社
Publication Dates: 2021
Call Number: TN405/1448
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8
面向电子封装的钉头金凸点制备关键技术

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Main Authors: 刘曰涛 (刘曰涛著)
Published: 西北工业大学出版社
Publication Dates: 2021
Call Number: TN430.594/0463
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9
器件和系统封装技术与应用 technologies and applications

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Main Authors: (美) 图马拉 Tummala, Rao R. ((美)拉奥 R. 图马拉(Rao R. Tummala)主编)
Group Author: 蔡镇 (译); 曹扬磊 (译); 曹中复 (译); 陈旭 (译)
Published: 机械工业出版社
Publication Dates: 2021
Call Number: TN405.94/6375
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10
电子封装技术设备操作手册

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Main Authors: 李红 (李红主编)
Published: 清华大学出版社
Publication Dates: 2021
Call Number: TN05-62/4421
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11
集成电路系统级封装

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Main Authors: 梁新夫 (梁新夫主编)
Published: 电子工业出版社
Publication Dates: 2021
Call Number: TN405/3905
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12
SiC/GaN功率半导体封装和可靠性评估技术

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Main Authors: (日) 菅沼克昭 ((日)菅沼克昭编著)
Group Author: 何钧 (文学) (译); 许恒宇 (译)
Published: 机械工业出版社
Publication Dates: 2021
Call Number: TN305.94/4734
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13
集成电路先进封装材料

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Main Authors: 王谦 (王谦等编著); 胡杨; 谭琳; 蔡坚
Published: 电子工业出版社
Publication Dates: 2021
Call Number: TN405/1137
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14
功率半导体封装技术

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Main Authors: 虞国良 (虞国良主编)
Published: 电子工业出版社
Publication Dates: 2021
Call Number: TN305.94/2263
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15
电子封装力学

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Main Authors: 龙旭 (龙旭著)
Published: 科学出版社
Publication Dates: 2020
Call Number: TN05/4040
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16
面向人工智能的超小贴装器件可靠性设计

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Main Authors: 赵志桓 (赵志桓著)
Published: 化学工业出版社
Publication Dates: 2020
Call Number: TN305.94/4844
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17
集成电路封装与测试

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Main Authors: 吕坤颐 (吕坤颐，刘新，牟洪江主编); 刘新; 牟洪江
Published: 机械工业出版社
Publication Dates: 2019
Call Number: TN405/6647
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18
倒装芯片缺陷无损检测技术

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Main Authors: 廖广兰 (廖广兰, 史铁林, 汤自荣著); 史铁林; 汤自荣
Published: 高等教育出版社
Publication Dates: 2019
Call Number: TN405.94/0208
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19
LED封装检测与应用

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Main Authors: 张泽奎 (张泽奎，任婷婷主编); 任婷婷
Published: 华中科技大学出版社
Publication Dates: 2019
Call Number: TN383.059.4/1234
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20
芯片先进封装制造

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Main Authors: 姚玉 (姚玉，周文成主编); 周文成
Published: 暨南大学出版社
Publication Dates: 2019
Call Number: TN430.594/4411
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