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Defects
Semiconductors
177
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111
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Integrated circuits
60
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42
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1
Corporate Authors:
Group Author:
Published: Wiley-IEEE Press,
Publication Dates: 2022.
Group Author:
Published: Wiley-IEEE Press,
Publication Dates: 2022.
2
Corporate Authors:
Group Author:
Published: Wiley-IEEE Press,
Publication Dates: 2022.
Group Author:
Published: Wiley-IEEE Press,
Publication Dates: 2022.
3
Corporate Authors:
Published: IEEE,
Publication Dates: [2022]
Call Number: TN4-532/I61.6/2022
;
Published: IEEE,
Publication Dates: [2022]
Call Number: TN4-532/I61.6/2022
4
Published: Applied Science Publishers,
Publication Dates: c1979-
Call Number: TQ051.3/D489/
Publication Dates: c1979-
Call Number: TQ051.3/D489/
5
Corporate Authors:
Published: Wiley-American Ceramic Society,
Publication Dates: 2021.
; ;
Published: Wiley-American Ceramic Society,
Publication Dates: 2021.
6
Corporate Authors:
Group Author: ;
Published: SPIE,
Publication Dates: [2021]
Call Number: TN43-532/D457/2021
;
Group Author: ;
Published: SPIE,
Publication Dates: [2021]
Call Number: TN43-532/D457/2021
7
Main Authors:
Group Author:
Published: Elsevier,
Publication Dates: [2021]
Call Number: TB302/G543/2nd ed.
Group Author:
Published: Elsevier,
Publication Dates: [2021]
Call Number: TB302/G543/2nd ed.
8
Corporate Authors:
Published: IEEE,
Publication Dates: [2021]
Call Number: TN4-532/I61.6/2021
;
Published: IEEE,
Publication Dates: [2021]
Call Number: TN4-532/I61.6/2021
9
Corporate Authors:
Group Author:
Published: Wiley,
Publication Dates: 2021.
Call Number: TQ171-532/C748/2019
;
Group Author:
Published: Wiley,
Publication Dates: 2021.
Call Number: TQ171-532/C748/2019
10
Corporate Authors:
Published: Wiley-American Ceramic Society,
Publication Dates: 2021.
; ;
Published: Wiley-American Ceramic Society,
Publication Dates: 2021.
11
Main Authors:
Group Author:
Published: John Wiley & Sons,
Publication Dates: 2020.
Call Number: O7/K29/3rd ed.
Group Author:
Published: John Wiley & Sons,
Publication Dates: 2020.
Call Number: O7/K29/3rd ed.
12
Corporate Authors:
Published: IEEE,
Publication Dates: [2020]
Call Number: TN4-532/I61.6/2020
; ; ;
Published: IEEE,
Publication Dates: [2020]
Call Number: TN4-532/I61.6/2020
13
Main Authors:
Published: World Scientific,
Publication Dates: [2020]
Call Number: O474/V437
Published: World Scientific,
Publication Dates: [2020]
Call Number: O474/V437
14
Corporate Authors:
Group Author: ;
Published: SPIE,
Publication Dates: [2020]
Call Number: TN43-532/D457/2020
;
Group Author: ;
Published: SPIE,
Publication Dates: [2020]
Call Number: TN43-532/D457/2020
15
Main Authors:
Published: Engineering Science Reference,
Publication Dates: [2020]
Call Number: TM21/D812-1
Published: Engineering Science Reference,
Publication Dates: [2020]
Call Number: TM21/D812-1
16
Main Authors:
Corporate Authors:
Published: Academic Press,
Publication Dates: [2019]
Corporate Authors:
Published: Academic Press,
Publication Dates: [2019]
17
Corporate Authors:
Published: IEEE,
Publication Dates: [2019]
Call Number: TN4-532/I61.6/2019
;
Published: IEEE,
Publication Dates: [2019]
Call Number: TN4-532/I61.6/2019
18
Corporate Authors:
Group Author:
Published: ASM International,
Publication Dates: [2019]
Call Number: TN407-62/M626/7th ed.
;
Group Author:
Published: ASM International,
Publication Dates: [2019]
Call Number: TN407-62/M626/7th ed.
19
Corporate Authors:
Group Author:
Published: John Wiley & Sons, Inc.,
Publication Dates: 2019.
Call Number: TQ171-532/C748/2018
;
Group Author:
Published: John Wiley & Sons, Inc.,
Publication Dates: 2019.
Call Number: TQ171-532/C748/2018
20
Main Authors:
Published: Academic Press,
Publication Dates: [2019]
Call Number: TG111.8/M972/2nd ed.
Published: Academic Press,
Publication Dates: [2019]
Call Number: TG111.8/M972/2nd ed.