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Handbook of organic materials for electronic and photonic devices /

Cover is for reference only
Corporate Authors: Elsevier Science & Technology.
Group Author: Ostroverkhova, Oksana.
Published: Woodhead Publishing, an imprint of Elsevier,
Publication Dates: [2019]
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Modeling, analysis, design, and tests for electronics packaging beyond Moore /

Cover is for reference only
Main Authors: Zhang, Hengyun
Corporate Authors: Elsevier Science & Technology.
Group Author: Che, Faxing; Lin, Tingyu; Zhao, Wensheng
Published: Woodhead Publishing, an imprint of Elsevier,
Publication Dates: [2020]
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Modeling, analysis, design, and tests for electronics packaging beyond Moore /

Cover is for reference only
Main Authors: Zhang, Hengyun
Group Author: Che, Faxing; Lin, Tingyu; Zhao, Wensheng
Published: Woodhead Publishing, an imprint of Elsevier,
Publication Dates: [2020]
Call Number: TN05/Z633
Book
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