馆藏书目查询系统 - 上海图书馆

1

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Enterprise digital transformation : technology, tools, and use cases /

Group Author: Augustine, Peter; Raj, Pethuru; Munirathinam, Sathyan
Published: CRC Press,
Publication Dates: 2022.
Call Number: TP273/E611

Book

2

Cover is for reference only

2022 IEEE Radiation Effects Data Workshop : (REDW 2022) : (in conjunction with 2022 NSREC) : Provo, Utah, USA, 18-22 July 2022.

Corporate Authors: IEEE Radiation Effects Data Workshop Provo, Utah, USA); Institute of Electrical and Electronics Engineers.; IEEE Nuclear and Space Radiation Effects Conference Provo, Utah, USA)
Published: IEEE,
Publication Dates: [2022]
Call Number: R144.1-532/I59/2022

Book

3

Cover is for reference only

Electronic engineers master：EEM.. 1986-87, v. A.

Published: Tech Publishers,
Publication Dates: c1986.
Call Number: TN1-62/E26-1/1986-87/v.A

Journal

4

Cover is for reference only

Electronics buyers' guide 1965.

Published: McGraw-Hill,
Publication Dates: 1965.
Call Number: F764.6-62/E387/1965

Journal

5

Cover is for reference only

Electronic engineers master：EEM.. V. 2,, Active components/ circuit assemblies/controls and drives.

Published: Tech Publishers,
Publication Dates: c1972.
Call Number: TN1-62/E26/1972-1973/v.2

Journal

6

Cover is for reference only

Electronic engineers master：EEM.. V. 3,, Passive components/ materials/ hardware.

Published: Tech Publishers,
Publication Dates: c1972.
Call Number: TN1-62/E26/1972-1973/v.3

Journal

7

Cover is for reference only

2022 IEEE 72th Electronic Components and Technology Conference : (ECTC 2022) : San Diego, California, USA, 31 May-3 June 2022.

Corporate Authors: Electronic Components and Technology Conference San Diego, California, USA); Institute of Electrical and Electronics Engineers.
Published: Institute of Electrical and Electronic Engineers, Inc.,
Publication Dates: [2022]
Call Number: TN6-532/E38/2022

Book

8

Cover is for reference only

2022 IEEE 34th International Conference on Microelectronic Test Structures : (ICMTS 2022) : Cleveland, Ohio, USA, 21-23 March 2022.

Corporate Authors: IEEE International Conference on Microelectronic Test Structures Cleveland, Ohio, USA); Institute of Electrical and Electronics Engineers.
Published: IEEE,
Publication Dates: [2022]
Call Number: TN407-532/I61/2022

Book

9

Cover is for reference only

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm 2022) : San Diego, California, USA, 31 May - 1 June 2022.

Corporate Authors: InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems San Diego, California, USA); Institute of Electrical and Electronics Engineers.
Published: IEEE,
Publication Dates: [2022]
Call Number: TN01-532/I61.1/2022

Book

10

Cover is for reference only

40th Electronic Components & Technology Conference：proceedings, May 20-23, 1990, Las Vegas, Nevada.

Corporate Authors: Electronic Components & Technology Conference 40th : 1990 : Las Vegas, Nevada; Institute of Electrical and Electronics Engineers
Published: IEEE,
Publication Dates: [1990].
Call Number: TN6-53/E38/1990/

Journal

11

Cover is for reference only

Electronic engineers master：EEM.. V. 1,, Test instruments/equipment and systems.

Published: Tech Publishers,
Publication Dates: c1972.
Call Number: TN1-62/e26/1972-1973/v.1

Journal

12

Cover is for reference only

2022 IEEE International Reliability Physics Symposium (IRPS 2022) : Dallas, Texas, USA, 27-31 March 2022.

Corporate Authors: IEEE International Reliability Physics Symposium Dallas, Texas, USA); Institute of Electrical and Electronics Engineers.
Published: IEEE,
Publication Dates: [2022]
Call Number: TN306-532/R382/2022

Book

13

Cover is for reference only

Electronics reliability & microminiaturization.. Vol. 2.

Published: Pergamon Press,
Publication Dates: c1963.
Call Number: TN4-55/E38/

Journal

14

Cover is for reference only

IEE journal on solid-state and electron devices：special issue on solar cells.. Vol. 2.

Corporate Authors: Institution of Electrical Engineers
Published: Institution of Electrical Engineers,
Publication Dates: 1978.
Call Number: TM914.4-55/I59/

Journal

15

Cover is for reference only

1987 IEEE International Symposium on Circuits and Systems：Dunfey City Line Hotel, Philadelphia, PA, May 4-7, 1987

Corporate Authors: IEEE International Symposium on Circuits and Systems (1987 Philadelphia, PA; IEEE Circuits and Systems Society; International Symposium on Circuits and Systems
Published: Institute of Electrical and Electronics Engineers
Publication Dates: c1987.
Call Number: TM13-532/I595/1987/v.1

Journal

16

Cover is for reference only

The hardware hacking handbook : breaking embedded security with hardware attacks /

Main Authors: Woudenberg, Jasper van
Group Author: O'Flynn, Colin
Published: No Starch Press, Inc.,
Publication Dates: [2022]
Call Number: TP309-62/W938

Book

17

Cover is for reference only

Practical ESD protection design /

Main Authors: Wang, Albert
Published: Wiley-IEEE Press,
Publication Dates: [2022]
Call Number: TN6/W246

Book

18

Cover is for reference only

PowerTest 2021 Conference : online, 8-11 March 2021.

Corporate Authors: PowerTest Conference Online); International Electrical Testing Association.; Curran Associates, Inc.
Published: International Electrical Testing Association,
Publication Dates: [2021]
Call Number: TM7-532/P888/2021

Book

19

Cover is for reference only

2021 IEEE International Electron Devices Meeting (IEDM 2021) : San Francisco, California, USA, 11-16 December 2021.

Corporate Authors: International Electron Devices Meeting San Francisco, California, USA); Institute of Electrical and Electronics Engineers.
Published: IEEE,
Publication Dates: [2021]
Call Number: TN11-532/I61/2021

Book

20

Cover is for reference only

2021 IEEE 71st Electronic Components and Technology Conference (ECTC 2021) : virtual conference, 1 June - 4 July 2021.

Corporate Authors: Electronic Components & Technology Conference Online); Institute of Electrical and Electronics Engineers.
Published: IEEE,
Publication Dates: [2021]
Call Number: TN6-532/E38/2021

Book

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