Reset Filters
Filter Related Topics: Multichip modules (Microelectronics)
Filter Related Topics within your search.
1
System-in-package RF design and applications

Cover is for reference only
Main Authors: Gaynor Michael P.
Published: Artech House,
Publication Dates: c2007.
Call Number: TN42/G287
Book
Save to List
Saved in:
2
Area array packaging processes for BGA, Flip Chip, and CSP

Cover is for reference only
Group Author: Gilleo Ken.
Published: McGraw-Hill,
Publication Dates: c2004.
Call Number: TN405.94/A678-1
Book
Save to List
Saved in:
3
Foldable flex and thinned silicon multichip packaging technology

Cover is for reference only
Group Author: Balde John W., 1923-
Published: Kluwer Academic Publishers,
Publication Dates: c2003.
Call Number: TN405.94/F663
Book
Save to List
Saved in:
4
Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies

Cover is for reference only
Main Authors: Lau John H.
Published: McGraw-Hill,
Publication Dates: c2000.
Call Number: TN42/L366
Book
Save to List
Saved in:
6
Multichip modules with integrated sensors

Cover is for reference only
Group Author: Jones W. Kinzy.; Harsányi Gábor.
Published: Kluwer Academic Publishers,
Publication Dates: c1996.
Call Number: TN42-532/M961.2/1995/
Book
Save to List
Saved in:
10
Routing in the third dimension from VLSI chips to MCMs

Cover is for reference only
Main Authors: Sherwani Naveed A.
Group Author: Bhingarde Siddharth.; Panyam Anand.
Published: IEEE Press,
Publication Dates: c1995.
Call Number: TN42/S554/
Book
Save to List
Saved in:
11
MCM C/mixed technologies and thick film sensors

Cover is for reference only
Group Author: Jones W. Kinzy.
Published: Kluwer Academic Publishers,
Publication Dates: c1995.
Call Number: TN42-532/M961.1/1994/
Book
Save to List
Saved in:
12
Multichip module design, fabrication, and testing

Cover is for reference only
Main Authors: Licari James J., 1930-
Published: McGraw-Hill,
Publication Dates: c1995.
Call Number: TN42/L698/
Book
Save to List
Saved in:
14
Multichip modules and related technologies MCM, TAB, and COB design

Cover is for reference only
Main Authors: Ginsberg Gerald L.
Group Author: Schnorr Donald P.
Published: McGraw-Hill,
Publication Dates: c1994.
Call Number: TN42/G493/
Book
Save to List
Saved in:
15
Microelectronic system interconnections performance and modeling

Cover is for reference only
Group Author: Tewksbury Stuart K.
Published: IEEE Press,
Publication Dates: c1994.
Call Number: TN405.97/M626/
Book
Save to List
Saved in:
16
Physical design for multichip modules

Cover is for reference only
Main Authors: Sriram M. (Mysore), 1966-
Group Author: Kang Sung-Mo, 1945-
Published: Kluwer Academic Publishers,
Publication Dates: c1994.
Call Number: TN42/S774/
Book
Save to List
Saved in:
17
Conceptual design of multichip modules and systems

Cover is for reference only
Main Authors: Sandborn Peter A., 1959-
Group Author: Moreno Hector, 1942-
Published: Kluwer Academic,
Publication Dates: c1994.
Call Number: TN402/S213/
Book
Save to List
Saved in:
18
Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Cover is for reference only
Main Authors: Pecht Michael.
Published: Wiley,
Publication Dates: c1994.
Call Number: TN45-62/P365/
Book
Save to List
Saved in:
19
Hybrid assemblies and multichip modules

Cover is for reference only
Main Authors: Kear Fred W., 1930-
Published: Dekker,
Publication Dates: c1993.
Call Number: TN45/K24/
Book
Save to List
Saved in:
20
Rapid thermal and laser processing 24-25 September 1992, San Jose, California

Cover is for reference only
Group Author: Muller Heinrich G.; Kwong Dim-Lee.
Published: SPIE,
Publication Dates: c1993.
Call Number: TN405-532/R218/1992/
Book
Save to List
Saved in:
Search Tools: Get RSS Feed — Email this Search —