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1
Encapsulation technologies for electronic applications /

Cover is for reference only
Main Authors: Ardebili, Haleh.
Corporate Authors: Elsevier Science & Technology.
Group Author: Zhang, Jiawei; Pecht, Michael.
Published: William Andrew,
Publication Dates: [2019]
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2
Encapsulation technologies for electronic applications /

Cover is for reference only
Main Authors: Ardebili, Haleh
Group Author: Zhang, Jiawei; Pecht, Michael
Published: William Andrew,
Publication Dates: [2019]
Call Number: TN605/A676/2nd ed.
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3
Encapsulation technologies for electronic applications /

Cover is for reference only
Main Authors: Ardebili, Haleh
Corporate Authors: Elsevier Science & Technology
Group Author: Pecht, Michael G
Published: William Andrew,
Publication Dates: 2009.
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4
Encapsulation technologies for electronic applications

Cover is for reference only
Main Authors: Ardebili Haleh
Group Author: Pecht Michael G
Published: William Andrew,
Publication Dates: 2009.
Call Number: TN605/A676
Book
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5
The simulation of thermomechanically induced stress in plastic encapsulated IC packages

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Main Authors: Kelly Gerard, Dr
Published: Kluwer Academic Publishers,
Publication Dates: c1999.
Call Number: TN405.94/K29/
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6
Encapsulation of electronic devices and components

Cover is for reference only
Main Authors: Salmon Edward R 1929-
Published: M. Dekker,
Publication Dates: c1987.
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7
Plastics in telecommunications III [international conference, 15, 16 and 17 September 1982]

Cover is for reference only
Corporate Authors: Plastics and Rubber Institute. Meetings Committee; Institution of Electrical Engineers
Published: Plastics and Rubber Institute,
Publication Dates: c1982.
Call Number: TN804-53/P715/1982/
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8
Einbettungen in Kunstharz

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Main Authors: Lautenschlager Ernst
Published: Wepf,
Publication Dates: 1976.
Call Number: TQ330.38/L389/
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9
Plastic coatings for electronics

Cover is for reference only
Main Authors: Licari James J 1930-
Published: McGraw-Hill,
Publication Dates: [1970]
Call Number: T7/CL698
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10
Electronic packaging with resins a practical guide for materials and manufacturing techniques

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Main Authors: Harper Charles A
Published: McGraw-Hill,
Publication Dates: 1961.
Call Number: 621.34/H293
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