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Solder and soldering Brazing 16 Electronic packaging 14 Lead-free electronics manufacturing processes 14 Welding 13 Design and construction 11 Electronic apparatus and appliances 9 more ...
1
Avoiding inelastic strains in solder joint interconnections of IC devices /

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Main Authors: Suhir, Ephraim
Published: CRC Press,
Publication Dates: 2021.
Call Number: TN405.97/S947
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2
Assembly and reliability of lead-free solder joints /

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Main Authors: Lau, John H.
Group Author: Lee, Ning-Cheng
Published: Springer,
Publication Dates: [2020]
Call Number: TG441.2/L366
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3
Lead-free soldering process development and reliability/

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Corporate Authors: Wiley Online Library (Online service)
Group Author: Bath, Jasbir.
Published: John Wiley & Sons, Inc.,
Publication Dates: 2020.
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4
Lead-free soldering process development and reliability /

Cover is for reference only
Group Author: Bath, Jasbir.
Published: John Wiley & Sons, Inc.,
Publication Dates: 2020.
Call Number: TN405.94/L434
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5
Lead-free soldering process development and reliability/

Cover is for reference only
Corporate Authors: Wiley Online Library (Online service)
Group Author: Bath, Jasbir.
Published: John Wiley & Sons, Inc.,
Publication Dates: 2020.
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6
Solder materials /

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Main Authors: Lin, Kwang-lung
Published: World Scientific Publishing Co. Pte. Ltd.,
Publication Dates: [2018]
Call Number: TG44/L735
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7
Mitigating tin whisker risks : theory and practice /

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Main Authors: Kato, Takahiko
Corporate Authors: Wiley InterScience Online service
Group Author: Handwerker, Carol A; Bath, Jasbir
Published: John Wiley & Sons, Inc.,
Publication Dates: [2016]
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8
The art of soldering for jewellery makers : techniques and projects /

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Main Authors: Devenney, Wing Mun
Published: Search Press,
Publication Dates: 2013.
Call Number: J536.1/D489
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9
Lead-free solders materials reliability for electronics

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Group Author: Subramaniam K. N Ph. D.
Published: Wiley,
Publication Dates: 2012.
Call Number: TG40/L434
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11
Lead free solder mechanics and reliability

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Main Authors: Pang John Hock Lye.
Corporate Authors: SpringerLink (Online service)
Published: Springer,
Publication Dates: c2012.
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15
Electrical conductive adhesives with nanotechnologies

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Main Authors: Li Yi
Group Author: Lu Daniel; Wong C. P 1947-
Published: Springer,
Publication Dates: c2010.
Call Number: TN305.94/L693
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17
Solder joint reliability prediction for multiple environments

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Main Authors: Perkins Andrew E.
Group Author: Sitaraman Suresh.
Published: Springer,
Publication Dates: c2009.
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18
Electrical conductive adhesives with nanotechnologies

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Main Authors: Li Yi. (Grace Yi)
Corporate Authors: SpringerLink (Online service)
Group Author: Lu Daniel.; Wong C. P., 1947-
Published: Springer,
Publication Dates: 2009.
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19
A guide to lead-free solders physical metallurgy and reliability

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Main Authors: Evans John W 1957-
Group Author: Engelmaier Werner 1939-
Published: Springer,
Publication Dates: c2007.
Call Number: TG40/E924
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