CMOS past, present and future /

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Bibliographic Details
Main Authors: Radamson, Henry H.
Corporate Authors: Elsevier Science & Technology.
Group Author: Luo, Jun; Simoen, Eddy; Zhao, Chao
Published: Woodhead Publishing,
Publisher Address: Duxford :
Publication Dates: 2018.
Literature type: eBook
Language: English
Series: Woodhead Publishing series in electronic and optical materials
Subjects:
Online Access: https://www.sciencedirect.com/science/book/9780081021392
http://www.sciencedirect.com/science/book/9780081021392
Item Description: Includes index.
Carrier Form: 1 online resource(vii, 263 pages).
ISBN: 9780081021408
0081021402
Index Number: TK7871
CLC: TN432
Contents: 1. Brief introduction CMOS applications in our daily life; 2. Basic definitions and equations; 3. Electrical measurements (IV, short channel effects, mobility and noise); 4. CMOS Architecture; 5. Strain engineering (stressor materials in source/drain regions, strain induced by processing, stress liners); 6. High-k and metal gate (Almost all known high-k materials and metal gates); 7. Channel materials (Ge, GeSn, SiGe, Graphene and other II-D crystals, III-V compounds); 8. Contacts (Silicide formation, contact resistance, parasitic contacts); 9. Integration with photonic components (CMOS with lasers, detectors); 10. Technology roadmap (starting from 50's to unknown future); 11. Authors' final words.