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Proceedings of the 9th International Symposium on the Physical & Failure Analysis of Integrated Circuits：IPFA 2002

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Bibliographic Details
Corporate Authors: International Symposium on the Physical & Failure Analysis of Integrated Circuits (9th 2002 Singapore; IEEE Reliability/CPMT/ED Singapore Chapter; IEEE Electron Devices Society; IEEE Reliability Society; National University of Singapore. Centre for IC Failure Analysis & Reliability
Group Author: Thong John
Published: IEEE,
Publisher Address: Piscataway, N.J.
Publication Dates: c2002.
Literature type: Book
Language: English
Subjects:
Integrated circuits > Defects
Integrated circuits > Testing
Carrier Form: [ix], [264] p.: ill. ; 29 cm.
Publication Frequency: Also available via the World Wide Web.
ISBN: 0780374169
Index Number: TN4
CLC: TN4-532
Call Number: TN4-532/I61.6/2002
Contents: "IEEE Catalog Number 02TH8614"--T.p. verso.
Includes bibliographical references and author index.

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