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Microvias：for low cost, high density interconnects

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Bibliographic Details
Main Authors: Lau John H
Group Author: Lee S. W. Ricky
Published: McGraw-Hill,
Publisher Address: New York
Publication Dates: c2001.
Literature type: Book
Language: English
Series: McGraw-Hill professional engineering
Subjects:
Microelectronic packaging
Integrated circuits > Design and construction > Cost control
Semiconductors > Junctions
Printed circuits
Carrier Form: xxiii, 565 p.: ill. ; 24 cm.
ISBN: 0071363270
Index Number: TN40
CLC: TN40
TN305
TN405.94
Call Number: TN405.94/L366
Contents: Includes bibliographical references and index.

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