Screen LibraryHandbook of silicon wafer cleaning technology /
Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal as...
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| Corporate Authors: | |
|---|---|
| Group Author: | ; |
| Published: |
William Andrew,
|
| Publisher Address: | Cambridge, MA : |
| Publication Dates: | [2018] |
| Literature type: | eBook |
| Language: | English |
| Edition: | Third edition. |
| Series: |
Materials science & process technology series
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| Subjects: | |
| Online Access: |
https://www.sciencedirect.com/science/book/9780323510844 |
| Summary: |
Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. |
| Carrier Form: | 1 online resource(773 pages). |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: |
9780323510851 032351085X 9780323510844 0323510841 |
| Index Number: | TK7871 |
| CLC: | TN304.1 |
| Contents: |
Front Cover; Handbook of Silicon Wafer Cleaning Technology; Handbook of Silicon Wafer Cleaning Technology; Copyright; Contents; List of Contributors; Foreword; Preface and Acknowledgments; I Introduction and Overview; 1 -- Overview and Evolution of Silicon Wafer Cleaning Technology a#x88;#x97;; 1.1 INTRODUCTION; 1.2 IMPORTANCE OF CLEAN AND CONDITIONED WAFER SURFACES; 1.2.1 Wafer Cleaning and Surface Conditioning Technology; 1.2.2 Wafer Cleaning and Surface Conditioning for Integrated Circuit Manufacturing; 1.3 OVERVIEW OF WAFER CONTAMINATION ASPECTS 1.3.1 Types and Origins of Contaminants and Defectivity1.3.2 Types of Semiconductor Wafers; 1.3.3 Effects of Contaminants and Defectivity on Silicon Device; 1.3.4 Prevention of Contamination and Defectivity; 1.4 OVERVIEW OF WAFER CLEANING AND SURFACE CONDITIONING TECHNOLOGY; 1.4.1 Liquid Processes and Wafer Drying Techniques; 1.4.2 Wet-Chemical Cleaning Processes; 1.4.2.1 Hydrofluoric Acid Solutions; 1.4.2.2 Sulfuric Acid and Hydrogen Peroxide Mixtures; 1.4.2.3 Original RCA Cleaning Process; 1.4.2.4 Modifications of the RCA Cleaning Process; 1.4.2.5 Alternative Cleaning Solutions 1.4.3 Alternative Wet-Chemical Cleaning and Surface Conditioning Systems1.4.3.1 Ohmi Clean; 1.4.3.2 IMEC Clean; 1.4.3.3 Diluted Dynamic Clean; 1.4.3.4 Single-Wafer/Short-Cycle Clean; 1.4.4 Equipment for Implementing Wet-Chemical Cleaning; 1.4.5 Wafer Rinsing, Drying, and Storing; 1.4.5.1 Wafer Rinsing; 1.4.5.2 Wafer Drying; 1.4.5.3 Wafer Storage; 1.4.6 Dry Cleaning and Surface Conditioning Processes; 1.4.6.1 General Considerations; 1.4.6.2 Vapor-Phase Cleaning Processes and Methods; 1.4.6.2.1 HF Vapor Etching, Cleaning, and Surface Conditioning 1.4.6.2.2 Ultraviolet/Ozone Cleaning for Removal of Organics1.4.6.2.3 UV/Chlorine Vapor-Phase Cleaning for Metal Removal; 1.4.6.2.4 Organochemical Vapor-Phase Cleaning Processes; 1.4.6.3 Plasma Stripping and Cleaning; 1.4.6.3.1 Introduction; 1.4.6.3.2 Stripping of Bulk Photoresist; 1.4.6.3.3 Removal of Etch Residues; 1.4.6.3.4 Predeposition Cleaning; 1.4.6.3.5 Surface Conditioning; 1.4.6.3.6 Cryogenic Aerosol and Supercritical Fluid Cleaning; 1.4.6.3.7 Cryogenic Aerosol Cleaning and Conditioning; 1.4.6.3.8 Supercritical Fluid Cleaning; 1.5 EVOLUTION OF WAFER CLEANING SCIENCE AND TECHNOLOGY 1.5.1 Period from 1950 to 19601.5.2 Period from 1961 to 1971; 1.5.2.1 Radiochemical Studies of Surface Contamination; 1.5.2.1.1 Development of the Original RCA Wafer Cleaning Procedure; 1.5.3 Period from 1972 to 1989; 1.5.3.1 Chronological Survey of the Literature on H2O2-Based Cleans; 1.5.3.2 Other Important Advances; 1.5.4 Period from 1989 to 1992; 1.5.4.1 Wet-Chemical Cleaning Processes; 1.5.4.2 Vapor-Phase Cleaning Methods; 1.5.5 Period From 1993 to 2006; 1.5.5.1 Trends and Milestones; 1.5.5.2 Liquid Processes and Wafer Drying Technology |