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Branch: 嘉定分馆(新馆) AND 徐汇康健

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三次元実装のためのTSV技術

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Bibliographic Details
Main Authors: 伝田精一 1931- (傳田精一著)
Published: 工業調査会
Publisher Address: 東京
Publication Dates: 2009.7
Literature type: Book
Language: Japanese
Subjects:
シリコン半導体
Carrier Form: 237p: 図 ; 21cm
ISBN: 9784769312864
Index Number: TN3
CLC: TN3
Call Number: WJTN3/2269-1

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