Screen LibraryModeling self-heating effects in nanoscale devices /
Accurate thermal modeling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient he...
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| Main Authors: | |
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| Group Author: | ; ; |
| Published: |
Morgan & Claypool Publishers,
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| Publisher Address: | San Rafael, CA : |
| Publication Dates: | [2017] |
| Literature type: | Book |
| Language: | English |
| Series: |
IOP concise physics,
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| Subjects: | |
| Summary: |
Accurate thermal modeling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modeling methods that must be employed in order to determine a device's temperature profile. |
| Item Description: |
"Version: 20170801"--Title page verso. "A Morgan & Claypool publication as part of IOP Concise Physics"--Title page verso. |
| Carrier Form: | 1 volume (various pagings) : illustrations (some color) ; 26 cm. |
| Bibliography: | Includes bibliographical references. |
| ISBN: |
9781681740591 1681740591 |
| Index Number: | TK7875 |
| CLC: | TB383 |
| Call Number: | TB383/R163 |
| Contents: | 1. Introduction -- 1.1. Some general aspects of heat conduction -- 1.2. Solution of the self-heating problem -- 1.3. Modeling heating effects in state of the art devices with the commercial tool SILVACO -- 2. Current state of the art in modeling heating effects in nanoscale devices -- 2.1. Some general considerations about the solution of the heat transport problem in devices -- 2.2. Solving lattice heating problem in nanoscale devices -- 2.3. Multi-scale modeling--modeling of circuits (CS and CD configuration) -- 2.4. Conclusions -- 3. Phonon Monte Carlo simulation -- 3.1. Phonon-phonon sca |