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晶粒取向薄硅钢片的试制和研究

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Bibliographic Details
Corporate Authors: 中华人民共和国科学技术委员会 (编印)
Published: 中华人民共和国科学技术委员会
Publisher Address: 北京
Publication Dates: 1965
Literature type: Book
Language: Chinese
Subjects:
硅钢晶粒取向 > 轧制
Carrier Form: 11页: 表,图 ; 26cm
Index Number: TG337
CLC: TG337.3
Call Number: 468.9514/2752

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