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Proceedings of the International Symposium on Thin Film Materials, Processes, Reliability, and Applications, Thin Film Processes

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Bibliographic Details
Corporate Authors: International Symposium on Thin Film Materials, Processes, Reliability, and Applications: Thin Film Processes (1997 Paris, France); Electrochemical Society. Electrodeposition Division.; Electrochemical Society. Meeting 1997 Paris, France) (Paris, France)); Electrochemical Society. Dielectric Science and Technology Division.; International Society of Electrochemistry. Meeting 1997 Paris, France) (Paris, France)); Electrochemical Society. Electronics Division.
Group Author: Engelhardt M.; (Michael); Mathad G. S.; Meyyappan M.
Published: Electrochemical Society,
Publisher Address: Pennington, NJ
Publication Dates: c1998.
Literature type: Book
Language: English
Series: Proceedings / Electrochemical Society ; v. 97-30
Subjects:
Plasma etching.
Thin film devices > Design and construction.
Thin films
Carrier Form: ix, 370 p.: ill. ; 23 cm.
ISBN: 1566771838
Index Number: TB43
CLC: TB43-532
TB383-532
Call Number: TB383-532/I617/1997
Contents: "Held as a part of the Joint International Meeting of the Electrochemical Society, Inc. and the International Society for Electrochemistry in Paris, France, Aug. 31-Sept. 5, 1997"--P. iii.
Includes bibliographical references and indexes.

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