Three-dimensional integrated circuit design /
"Three-dimensional integrated circuit design, second edition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Sav...
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Main Authors: | |
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Group Author: | ; |
Published: |
Morgan Kaufmann Publishers, an imprint of Elsevier,
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Publisher Address: | Cambridge, MA : |
Publication Dates: | [2017] |
Literature type: | Book |
Language: | English |
Edition: | Second edition. |
Subjects: | |
Summary: |
"Three-dimensional integrated circuit design, second edition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effectiv |
Carrier Form: | l, 718 pages : illustrations ; 24 cm |
Bibliography: | Includes bibliographical references (pages 669-707) and index. |
ISBN: |
9780124105010 0124105017 |
Index Number: | TK7874 |
CLC: | TN402 |
Call Number: | TN402/P338/2nd ed. |