Chemical mechanical planarization VI:proceedings of the international symposium
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Corporate Authors: | ; ; |
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Group Author: | ; |
Published: |
Electrochemical Society,
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Publisher Address: | Pennington, NJ |
Publication Dates: | c2003. |
Literature type: | Book |
Language: | English |
Series: |
Proceedings ; v. 2003-21 |
Subjects: | |
Carrier Form: | vii, 358 p.: ill. ; 24 cm. |
ISBN: | 1566774047 |
Index Number: | TN403 |
CLC: |
TN403-532 TN405-532 |
Call Number: | TN403-532/I617/2003 |
Contents: |
" ... proceedings of the 6th International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit Device Manufacturing held at the 204th Meeting of the Electrochemical Society, in Orlando, Florida from October 12th to 17th, 2003"--Pref. "Sponsoring division, Electronics." Includes bibliographical references and indexes. |