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Chemical mechanical planarization VI：proceedings of the international symposium

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Bibliographic Details
Corporate Authors: International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (6th 2003 Orlando, Fla.); Electrochemical Society. Electronics Division.; Electrochemical Society. Meeting 2003 Orlando, Fla.) (Orlando, Fla.))
Group Author: Seal S.; (Sudipta)
Published: Electrochemical Society,
Publisher Address: Pennington, NJ
Publication Dates: c2003.
Literature type: Book
Language: English
Series: Proceedings ; v. 2003-21
Subjects:
Metals > Pickling.
Integrated circuits > Materials.
Microelectronics > Materials.
Grinding and polishing.
Carrier Form: vii, 358 p.: ill. ; 24 cm.
ISBN: 1566774047
Index Number: TN403
CLC: TN403-532
TN405-532
Call Number: TN403-532/I617/2003
Contents: " ... proceedings of the 6th International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit Device Manufacturing held at the 204th Meeting of the Electrochemical Society, in Orlando, Florida from October 12th to 17th, 2003"--Pref.
"Sponsoring division, Electronics."
Includes bibliographical references and indexes.

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