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CLC: T - 工业技术

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Design, characterization, and packaging for MEMS and microelectronics II：17-19 December, 2001, Adelaide, Australia

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Bibliographic Details
Corporate Authors: United States. Air Force. Asian Office of Aerospace Research and Development; Institute of Electrical and Electronics Engineers. South Australia Section; Society of Photo-Optical Instrumentation Engineers
Group Author: Franzon Paul D
Published: SPIE,
Publisher Address: Bellingham, Washington
Publication Dates: c2001.
Literature type: Book
Language: English
Series: Proceedings of SPIE ; v. 4593
Subjects:
Microelectronic packaging
Microelectromechanical systems > Design and construction
Carrier Form: ix, 322 p.: ill. ; 28 cm.
ISBN: 0819443239
Index Number: TN40
CLC: TN40-532
TM380.5-532
TM-39
TM380.2-532
Call Number: TM380.2-532/D457/2001
Contents: Includes bibliographic references and author index.

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