Screen LibraryRobust design of microelectronics assemblies against mechanical shock, temperature and moisture /
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| Main Authors: | |
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| Group Author: | |
| Published: |
Woodhead Publishing, an imprint of Elsevier,
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| Publisher Address: | Sawston, Cambridge, UK : |
| Publication Dates: | [2015] |
| Literature type: | Book |
| Language: | English |
| Series: |
Woodhead Publishing series in electronic and optical materials ; no. 81 |
| Subjects: | |
| Carrier Form: | xviii, 457 pages : illustrations (some color) ; 23 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: |
9781845695286 1845695283 |
| Index Number: | TK7870 |
| CLC: | TN081 |
| Call Number: | TN081/W872 |