Screen LibraryHandbook of silicon wafer cleaning technology /
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with...
Saved in:
| Corporate Authors: | |
|---|---|
| Group Author: | ; |
| Published: |
William Andrew,
|
| Publisher Address: | Norwich, NY : |
| Publication Dates: | 2008. |
| Literature type: | eBook |
| Language: | English |
| Edition: | Second edition. |
| Series: |
Materials science & process technology series
|
| Subjects: | |
| Online Access: |
http://www.sciencedirect.com/science/book/9780815515548 |
| Summary: |
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and th |
| Carrier Form: | 1 online resource (xxvi, 718 pages) : illustrations. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: |
9780815517733 0815517734 9780815515548 0815515545 9780815517719 0815517718 |
| Index Number: | TK7871 |
| CLC: | TN304.1 |
| Contents: | Part 1: Introduction and Overview -- Overview and Evolution of Silicon Wafer Cleaning Technology -- Overview of Wafer Contamination and Defectivity -- Part 2: Wet-Chemical Processes -- Particle Deposition and Adhesion -- Aqueous Cleaning and Surface Conditioning Processes -- Part 3: Dry Cleaning Processes -- Gas-phase Wafer Cleaning Technology -- Plasma Stripping and Cleaning -- Cryogenic Aerosols and Supercritical Fluid Cleaning -- Part 4: Analytical and Control Aspects -- Detection and Measurement of Particulate Contaminants -- Surface Chemical Composition and Morphology -- Ultratrace Impu |