Screen LibraryModeling, analysis, design, and tests for electronics packaging beyond Moore /
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| Main Authors: | |
|---|---|
| Group Author: | ; ; |
| Published: |
Woodhead Publishing, an imprint of Elsevier,
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| Publisher Address: | Duxford, United Kingdom : |
| Publication Dates: | [2020] |
| Literature type: | Book |
| Language: | English |
| Series: |
Woodhead Publishing series in electronic and optical materials
Series on advanced electronic packaging technology and key materials |
| Subjects: | |
| Carrier Form: | xvi, 418 pages : illustrations (some color) ; 23 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: |
9780081025321 0081025327 |
| Index Number: | TJ7870 |
| CLC: | TN05 |
| Call Number: | TN05/Z633 |