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1

Cover is for reference only

Test and measurement applications of optoelectronic devices：21-22 January, 2002, San Jose, USA

Group Author: Chin Aland K
Published: SPIE,
Publication Dates: c2002.
Call Number: TN203-532/T342/2002

Book

2

Cover is for reference only

Optical fiber and fiber component mechanical reliability and testing II：21 January 2002, San Jose, [California] USA

Corporate Authors: Society of Photo-Optical Instrumentation Engineers
Group Author: Kurkjian Charles R; Matthewson M. John
Published: SPIE,
Publication Dates: c2002.
Call Number: TN25-532/O626/2002

Book

3

Cover is for reference only

Reliability, packaging, testing, and characterization of MEMS/MOEMS VII：21-22 January 2008, San Jose, California, USA

Corporate Authors: Society of Photo-Optical Instrumentation Engineers; Boston University. Photonics Center
Group Author: Hartzell Allyson L; Ramesham Rajeshuni
Published: SPIE,
Publication Dates: c2008.
Call Number: TN406-532/R382/2008

Book

4

Cover is for reference only

Materials reliability in microelectronics V：symposium held April 17-21, 1995, San Francisco, California, U.S.A.

Group Author: Oates Anthony S.
Published: Materials Research Society,
Publication Dates: c1995.
Call Number: TN40-532/M425/1995

Book

5

Cover is for reference only

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits : (IPFA 2016) : Singapore, 18-21 July 2016.

Corporate Authors: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Singapore; Institute of Electrical and Electronic Engineers
Published: IEEE,
Publication Dates: [2016]
Call Number: TN4-532/I61.6/2016

Book

6

Cover is for reference only

2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits : (IPFA 2014), Singapore, 30 June-4 July 2014 /

Corporate Authors: International Symposium on the Physical and Failure Analysis of Integrated Circuits Singapore; Institute of Electrical and Electronic Engineers
Published: IEEE,
Publication Dates: [2014]
Call Number: TN4-532/I61.6/2014

Book

7

Cover is for reference only

2015 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits : (IPFA 2015), Hsinchu, Taiwan, 29 June-2 July 2015.

Corporate Authors: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Hsinchu, Taiwan; Institute of Electrical and Electronic Engineers
Published: IEEE,
Publication Dates: [2015]
Call Number: TN4-532/I61.6/2015

Book

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