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1

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C语言程序设计现代方法 = C programming:a modern approach

Main Authors: 美金 King, K. N ((美)K. N. King著)
Group Author: 吕秀锋 (译)
Published: 人民邮电出版社
Publication Dates: 2007
Call Number: TP312/8010

Book

2

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C语言程序设计：现代方法 = C Programming：a modern approach

Main Authors: (美) 金 King, K. N. ((美)K. N. 金(K. N. King)著)
Group Author: 吕秀锋 (译); 黄倩 (译)
Published: 人民邮电出版社
Publication Dates: 2021
Call Number: TP312.8/8010

Book

3

C语言程序设计现代方法(第2版·修订版)习题解答 a modern approach, 2nd edition

Cover is for reference only

C语言程序设计：现代方法(第2版·修订版)习题解答 = C programming：a modern approach, 2nd edition

Main Authors: (美) 金 King, K. N. (著)
Group Author: 曹良亮 (编)
Published: 人民邮电出版社
Publication Dates: 2022
Call Number: TP312.8/8010-1

Book

4

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Electronic packaging science and technology /

Main Authors: Tu, K. N. (King-Ning), 1937-
Group Author: Chen, Chih, 1970-; Chen, Hung-Ming
Published: Wiley,
Publication Dates: 2022.
Call Number: TN05/T883

Book

5

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36th Annual Southeast Conference：Marietta, Georgia, April 1-3, 1998 : proceedings

Corporate Authors: Association for Computing Machinery. Annual Southeast Conference (36th 1998 Marietta, Georgia
Group Author: King K. N
Published: ACM Press,
Publication Dates: c1998.
Call Number: TP-532/A512/1998/

Book

6

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Elements of electromigration : electromigration in 3D IC technology /

Main Authors: Tu, K. N. (King-Ning), 1937- (Author)
Group Author: Liu, Yingxia
Published: CRC Press, Taylor & Francis Group,
Publication Dates: 2024.
Call Number: TG113.22/T883

Book

7

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Kinetics in nanoscale materials /

Main Authors: Tu, K. N. (King-Ning), 1937- (Author)
Group Author: Gusak, Andriy M.
Published: Wiley,
Publication Dates: [2014]
Call Number: TB383/T883

Book

8

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Solder joint technology：materials, properties, and reliability

Main Authors: Tu K. N (King-ning), 1937-
Published: Springer,
Publication Dates: c2007.
Call Number: TG441/T883

Book

9

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C programming：a modern approach

Main Authors: King K. N. (Kim N.)
Published: W.W. Norton & Company,
Publication Dates: c2008.
Call Number: TP312C/K534/2nd.ed.

Book

10

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Silicon and Silicide Nanowires : Applications, Fabrication, and Properties /

Group Author: Huang, Yu College teacher; Tu, K. N. King-Ning, 1937
Published:
Call Number: O613.72/S583-3

Book

11

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Electronic thin film reliability

Main Authors: Tu K. N. (King-ning), 1937-
Published: Cambridge University Press,
Publication Dates: 2011.
Call Number: TB43-43/T883

Book

12

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Solder joint technology：materials, properties, and reliability

Main Authors: Tu K. N. (King-ning), 1937-
Corporate Authors: SpringerLink (Online service)
Published: Springer,
Publication Dates: c2007.

Book

13

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Nanocontacts - Emerging materials and processing for ohmicity and rectification : April 9-13, 2012, San Francisco, California, USA /

Corporate Authors: Nanocontacts - Emerging Materials and Processing for Ohmicity and Rectification Symposium San Francisco, Calif; Materials Research Society. Spring Meeting
Group Author: Talin, Albert Alec, 1967; Islam, M. Saiful, 1970; Lavoie, Christian; Tu, K. N. King-Ning, 1937
Published: Cambridge University Press,
Publication Dates: [2012]
Call Number: TB383-532/N186-62/2012

Book

14

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1998 5th International Conference on Solid-State and Integrated Circuit Technology：proceedings, October 21-23 : 1998, Beijing, China

Corporate Authors: International Conference on Solid-State and Integrated Circuit Technology (5th 1998 Beijing, China); Chung-kuo tien tzu hsüeh hui.; IEEE Electron Devices Society.; IEEE Solid-State Circuits Society.
Group Author: Zhang Min.; Tu K. N.; (King-ning), 1937-
Published: Institute of Electrical and Electronics Engineers,
Publication Dates: [1998].
Call Number: TN4-532/I61.10/1998/

Book

15

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Thin films and interfaces：proceedings of the Materials Research Society Annual Meeting, November 1981, Boston Park Plaza Hotel, Boston, Massachusetts, U.S.A.

Corporate Authors: Materials Research Society. Meeting (1981 Boston, Mass.) (Boston, Mass.))
Group Author: Ho P. S.; Tu K. N.; (King-ning), 1937-
Published: North-Holland,
Publication Dates: c1982.
Call Number: O484-53/S989/1981/

Book

16

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Electronic packaging materials science：symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A.

Corporate Authors: Electronic Packaging Materials Science Symposium (1984 Boston, Mass.) (Boston, Mass.)); Materials Research Society. Meeting (1984 Boston, Mass.) (Boston, Mass.))
Group Author: Giess Edward A.; Tu K. N.; (King-ning), 1937-; Uhlmann D. R.; (Donald Robert)
Published: Materials Research Society,
Publication Dates: 1985.
Call Number: TN105-53/E38/1984/

Book

17

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Thin films：interdiffusion and reactions

Group Author: Poate J. M.; Tu K. N.; (King-ning), 1937-; Mayer James W., 1930-
Published: Wiley,
Publication Dates: c1978.
Call Number: TN304.055/P739/

Book

18

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Polysilicon films and interfaces：symposium held December 1-3, 1987, Boston, Massachusetts, U.S.A.

Group Author: Wong C. Y.; (Catherine Y.); Thompson C. V.; (Carl V.); Tu K. N.; (King-ning), 1937-
Published: Materials Research Society,
Publication Dates: c1988.
Call Number: TB32-53/P781/1987/

Book

19

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It's all in the water : studies of materials and conditions in fresh and salt water bodies /

Corporate Authors: American Chemical Society. Division of Environmental Chemistry.
Group Author: Benvenuto, Mark A. (Mark Anthony)
Published:
Call Number: TU991.21/I896

Book

20

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Routledge handbook of cultural sociology /

Group Author: Grindstaff, Laura (Editor); Lo, Ming-cheng Miriam (Editor); Hall, John R. (Editor)
Published: Routledge,
Publication Dates: 2019.
Call Number: G0/H236/2nd ed.

Book

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