Author Results for King K. N

SpringerLink (Online service)
Tu,K. N.
(King-ning),
(美)K. N. 金(K. N. King)著
Elsevier Science & Technology
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King-Ning Tu
Materials Research Society.,Meeting
Wiley Online Library (Online service)
(Carl V.)
(Catherine Y.)

1
C语言程序设计现代方法

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Main Authors: 美 金 King, K. N ((美)K. N. King著)
Group Author: 吕秀锋 (译)
Published: 人民邮电出版社
Publication Dates: 2007
Call Number: TP312/8010
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2
C语言程序设计 现代方法 a modern approach

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Main Authors: (美) 金 King, K. N. ((美)K. N. 金(K. N. King)著)
Group Author: 吕秀锋 (译); 黄倩 (译)
Published: 人民邮电出版社
Publication Dates: 2021
Call Number: TP312.8/8010
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3
Kinetics in nanoscale materials /

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Main Authors: Tu, K. N. King-Ning, 1937
Group Author: Gusak, Andriy M
Published: John Wiley & Sons,
Publication Dates: 2014.
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4
Kinetics in nanoscale materials /

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Main Authors: Tu, K. N. King-Ning, 1937
Group Author: Gusak, Andriy M
Published: Wiley,
Publication Dates: [2014]
Call Number: TB383/T883
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5
C语言程序设计 现代方法(第2版·修订版)习题解答 a modern approach, 2nd edition

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Main Authors: (美) 金 King, K. N. (著)
Group Author: 曹良亮 (编)
Published: 人民邮电出版社
Publication Dates: 2022
Call Number: TP312.8/8010-1
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7
Electronic packaging science and technology /

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Main Authors: Tu, K. N. (King-Ning), 1937-
Group Author: Chen, Chih, 1970-; Chen, Hung-Ming
Published: Wiley,
Publication Dates: 2022.
Call Number: TN05/T883
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10
Elements of electromigration : electromigration in 3D IC technology /

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Main Authors: Tu, K. N. (King-Ning), 1937- (Author)
Group Author: Liu, Yingxia
Published: CRC Press, Taylor & Francis Group,
Publication Dates: 2024.
Call Number: TG113.22/T883
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11
Solder joint technology materials, properties, and reliability

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Main Authors: Tu K. N (King-ning), 1937-
Published: Springer,
Publication Dates: c2007.
Call Number: TG441/T883
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12
C programming a modern approach

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Main Authors: King K. N. (Kim N.)
Published: W.W. Norton & Company,
Publication Dates: c2008.
Call Number: TP312C/K534/2nd.ed.
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13
Electronic thin film reliability

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Main Authors: Tu K. N. (King-ning), 1937-
Published: Cambridge University Press,
Publication Dates: 2011.
Call Number: TB43-43/T883
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14
Solder joint technology materials, properties, and reliability

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Main Authors: Tu K. N. (King-ning), 1937-
Corporate Authors: SpringerLink (Online service)
Published: Springer,
Publication Dates: c2007.
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15
Preparation and properties of thin films /

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Corporate Authors: Elsevier Science & Technology
Group Author: Tu, K. N. King-Ning, 1937; Rosenberg, R
Published: Academic Press,
Publication Dates: 1982.
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17
Analytical techniques for thin films /

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Corporate Authors: Elsevier Science & Technology.
Group Author: Tu, K. N. (King-Ning), 1937-; Rosenberg, R.
Published: Academic Press,
Publication Dates: 1988.
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