1
The IoT physical layer : design and implementation /

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Group Author: Elfadel, Ibrahim M; Ismail, Mohammed
Published: Springer International Publishing AG,
Publication Dates: [2019]
Call Number: TP393.4/I619-22
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2
3D stacked chips : from emerging processes to heterogeneous systems /

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Group Author: Elfadel, Ibrahim M. Abe; Fettweis, Gerhard P
Published: Springer,
Publication Dates: [2016]
Call Number: TN402/T531
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3
Machine learning in VLSI computer-aided design /

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Group Author: Elfadel, Ibrahim Abe M; Boning, Duane S; Li, Xin, 1977
Published: Springer,
Publication Dates: [2019]
Call Number: TN470.2/M149
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