Thermal conductivity 26：thermal expansion 14 : joint conferences, August 6-8, 2001, Cambridge, Massachusetts, USA

Corporate Authors: International Thermal Conductivity Conference (26th 2001 Cambridge, Mass.); International Thermal Expansion Symposium 2001 Cambridge, Mass.) (Cambridge, Mass.)); Holometrix Micromet.
Group Author: Mannello Rick.; Dinwiddie Ralph B.
Published: DEStech Publications,
Publication Dates: c2005.
Call Number: O551.3-532/T411/2001