Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA /

Corporate Authors: International Thermal Conductivity Conference Logan, Utah; International Thermal Expansion Symposium Logan, Utah
Group Author: Ban, Heng
Published: DEStech Publications, Inc.,
Publication Dates: [2018]
Call Number: O551.3-532/T441/2017