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1

Cover is for reference only

Electronic packaging science and technology /

Main Authors: Tu, K. N. (King-Ning), 1937-
Corporate Authors: Wiley Online Library (Online service)
Group Author: Chen, Chih, 1970-; Chen, Hung-Ming
Published: Wiley,
Publication Dates: 2022.

eBook

2

Cover is for reference only

Electronic packaging science and technology /

Main Authors: Tu, K. N. (King-Ning), 1937-
Group Author: Chen, Chih, 1970-; Chen, Hung-Ming
Published: Wiley,
Publication Dates: 2022.
Call Number: TN05/T883

Book

3

Cover is for reference only

Electronic packaging science and technology /

Main Authors: Tu, K. N. (King-Ning), 1937-
Corporate Authors: Wiley Online Library (Online service)
Group Author: Chen, Chih, 1970-; Chen, Hung-Ming
Published: Wiley,
Publication Dates: 2022.

eBook

4

Cover is for reference only

Solder joint technology：materials, properties, and reliability

Main Authors: Tu K. N (King-ning), 1937-
Published: Springer,
Publication Dates: c2007.
Call Number: TG441/T883

Book

5

Cover is for reference only

Electronic thin film reliability

Main Authors: Tu K. N. (King-ning), 1937-
Published: Cambridge University Press,
Publication Dates: 2011.
Call Number: TB43-43/T883

Book

6

Cover is for reference only

Solder joint technology：materials, properties, and reliability

Main Authors: Tu K. N. (King-ning), 1937-
Corporate Authors: SpringerLink (Online service)
Published: Springer,
Publication Dates: c2007.

Book

7

Cover is for reference only

1998 5th International Conference on Solid-State and Integrated Circuit Technology：proceedings, October 21-23 : 1998, Beijing, China

Corporate Authors: International Conference on Solid-State and Integrated Circuit Technology (5th 1998 Beijing, China; Chung-kuo tien tzu hsüeh hui; IEEE Electron Devices Society; IEEE Solid-State Circuits Society
Group Author: Zhang Min; Tu K. N; King-ning 1937-
Published: Institute of Electrical and Electronics Engineers,
Publication Dates: [1998].
Call Number: TN4-532/I61.10/1998/

Book

8

Cover is for reference only

Analytical techniques for thin films /

Corporate Authors: Elsevier Science & Technology.
Group Author: Tu, K. N. (King-Ning), 1937-; Rosenberg, R.
Published: Academic Press,
Publication Dates: 1988.

eBook

9

Cover is for reference only

Thin films and interfaces：proceedings of the Materials Research Society Annual Meeting, November 1981, Boston Park Plaza Hotel, Boston, Massachusetts, U.S.A.

Corporate Authors: Materials Research Society. Meeting (1981 Boston, Mass.)
Group Author: Ho P. S; Tu K. N; King-ning 1937-
Published: North-Holland,
Publication Dates: c1982.
Call Number: O484-53/S989/1981/

Book

10

Cover is for reference only

Electronic packaging materials science：symposium held November 27-29, 1984, Boston, Massachusetts, U.S.A.

Corporate Authors: Electronic Packaging Materials Science Symposium (1984 Boston, Mass.); Materials Research Society. Meeting (1984 Boston, Mass.)
Group Author: Giess Edward A; Tu K. N; King-ning 1937-; Uhlmann D. R; Donald Robert
Published: Materials Research Society,
Publication Dates: 1985.
Call Number: TN105-53/E38/1984/

Book

11

Cover is for reference only

Thin films：interdiffusion and reactions

Group Author: Poate J. M; Tu K. N; King-ning 1937-; Mayer James W 1930-
Published: Wiley,
Publication Dates: c1978.
Call Number: TN304.055/P739/

Book

12

Cover is for reference only

Polysilicon films and interfaces：symposium held December 1-3, 1987, Boston, Massachusetts, U.S.A.

Group Author: Wong C. Y; Catherine Y; Thompson C. V; Carl V; Tu K. N; King-ning 1937-
Published: Materials Research Society,
Publication Dates: c1988.
Call Number: TB32-53/P781/1987/

Book

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