Author Results for Reliability Analysis Center U.S

Reliability Analysis Center U.S
IIT Research Institute
Rome Air Development Center
sponsored by IIT Research Institute
Anderson,R. T
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Edfors,H. C
Electrical Overstress/Electrostatic Discharge Symposium,Las Vegas, Nevada
Electrical Overstress/Electrostatic Discharge Symposium,San Diego, Calif
Flint,Steven J
Hommey,Gene A

1
Reliability considerations in plastic encapsulated microcircuits

Cover is for reference only
Main Authors: Edfors H. C
Corporate Authors: Reliability Analysis Center U.S
Published: IIT Research Institute,
Publication Dates: 1971.
Call Number: TN405.94/E22
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2
Microcircuit device reliability linear/interface data

Cover is for reference only
Main Authors: Flint Steven J
Corporate Authors: Reliability Analysis Center U.S; Rome Air Development Center
Published: Reliability Analysis Center, Rome Air Development Center,
Publication Dates: 1979.
Call Number: TN4-64/R382/1979/
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3
Microcircuit device reliability linear/interface data

Cover is for reference only
Main Authors: Hommey Gene A
Corporate Authors: Reliability Analysis Center U.S; Rome Air Development Center
Group Author: Paquette Thomas E
Published: Reliability Analysis Center, Rome Air Development Center,
Publication Dates: 1977
Call Number: TN4-64/R382/1977/
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4
Hybrid circuit data /

Cover is for reference only
Main Authors: Turner, Timothy E
Corporate Authors: Rome Air Development Center; Reliability Analysis Center U.S
Published:
Call Number: TN45/T944
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5
Memory/LSI data.

Cover is for reference only
Corporate Authors: Reliability Analysis Center U.S; Rome Air Development Center
Published:
Call Number: TN406-64/M533
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6
Discrete semiconductor reliability transistor/diode data

Cover is for reference only
Main Authors: Walker Roy C (prepared by Roy C. Walker, David B. Nicholls, Reliability Analysis Center (IIT Research Institute).)
Corporate Authors: IIT Research Institute; Reliability Analysis Center U.S
Group Author: Nicholls David B (joint author.)
Published: Reliability Analysis Center, Rome Air Development Center,
Publication Dates: 1977.
Call Number: TN32/R382/
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7
Reliability design handbook

Cover is for reference only
Corporate Authors: IIT Research Institute; Reliability Analysis Center U.S
Group Author: Anderson R. T
Published: Rome Air Development Center,
Publication Dates: 1976.
Call Number: TJ1-62/R382/1976/
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8
Hybrid microcircuit reliability data

Cover is for reference only
Corporate Authors: Reliability Analysis Center U.S; IIT Research Institute
Published: Pergamon,
Publication Dates: 1975.
Call Number: TN45/R382/
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9
Microcircuit reliability bibliography.

Cover is for reference only
Corporate Authors: Reliability Analysis Center U.S; United States. Air Force. Rome Air Development Center
Published: IIT Research Institute,
Publication Dates: 1973.
Call Number: Z88:TN06/M626/v.1B
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