馆藏书目查询系统 - 上海图书馆

1

Cover is for reference only

Corporate Authors: International Thermal Conductivity Conference 1995 Nashville, Tenn.)
Group Author: Dinwiddie Ralph B; Graves Ronald S; Wilkes Kenneth Earl 1944-
Published: Technomic Pub.,
Publication Dates: c1996.
Call Number: O551.3-532/T411/1995/

Book

2

Cover is for reference only

Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA /

Corporate Authors: International Thermal Conductivity Conference Logan, Utah; International Thermal Expansion Symposium Logan, Utah
Group Author: Ban, Heng
Published: DEStech Publications, Inc.,
Publication Dates: [2018]
Call Number: O551.3-532/T441/2017

Book

3

Cover is for reference only

Thermal conductivity 16

Corporate Authors: International Thermal Conductivity Conference (16th 1979 Chicago, Ill; IIT Research Institute
Group Author: Larsen David C
Published: Plenum Press,
Publication Dates: c1982.
Call Number: O551.3-53/I61/1979/

Book

4

Cover is for reference only

Advances in thermal conductivity : papers presented at XII [i.e. XIII] International Conference on Thermal Conductivity, November 5-7, 1974 [i.e. 1973], Lodge of the Four Seasons, Lake Ozark, Missouri /

Corporate Authors: International Thermal Conductivity Conference Lake Ozark, Mo; University of Missouri--Rolla. Extension Division
Group Author: Reisbig, Ronald L; Sauer, Harry J., Jr., 1935-2008
Published:
Call Number: O551.3-532/I61/1973

Book

5

Cover is for reference only

Thermal conductivity 17

Corporate Authors: International Thermal Conductivity Conference (17th 1981 Gaithersburg, Md.)
Group Author: (Jerome G.); Hust J. G.
Published: Plenum Press,
Publication Dates: c1983.
Call Number: O551.3-532/T411/1981

Book

6

Cover is for reference only

Thermal conductivity 20

Corporate Authors: International Thermal Conductivity Conference (20th 1987 Blacksburg, Va.)
Group Author: Thomas J. R.; (James Russell), 1941-; Hasselman D. P. H., 1931-
Published: Plenum Press,
Publication Dates: c1989.
Call Number: O551.3-53/I61/1987/

Book

7

Cover is for reference only

Thermal conductivity 25：thermal expansion 13 : joint conferences, June 13-16, 1999, Ann Arbor, Michigan, USA

Corporate Authors: International Thermal Conductivity Conference 1999 Ann Arbor, Mich.) (Ann Arbor, Mich.)); International Thermal Expansion Symposium 1999 Ann Arbor, Mich.) (Ann Arbor, Mich.))
Group Author: Morelli Donald; Uher Ctirad.
Published: Technomic Pub. Co.,
Publication Dates: [c2000]
Call Number: O551.3-532/T411/1999

Book

8

Cover is for reference only

Thermal conductivity 26：thermal expansion 14 : joint conferences, August 6-8, 2001, Cambridge, Massachusetts, USA

Corporate Authors: International Thermal Conductivity Conference (26th 2001 Cambridge, Mass.); International Thermal Expansion Symposium 2001 Cambridge, Mass.) (Cambridge, Mass.)); Holometrix Micromet.
Group Author: Mannello Rick.; Dinwiddie Ralph B.
Published: DEStech Publications,
Publication Dates: c2005.
Call Number: O551.3-532/T411/2001

Book

9

Cover is for reference only

Thermal conductivity 29：thermal expansion 17 : joint conferences : June 24-27, 2007, Birmingham, Alabama, USA

Corporate Authors: International Thermal Conductivity Conference (29th 2007 Birmingham, Alabama); International Thermal Expansion Symposium 2007 Birmingham, Alabama) (Birmingham, Alabama)); Southern Research Institute (Birmingham, Ala.)
Group Author: Ban Heng, 1960-; Koenig John R.
Published: DEStech Publications,
Publication Dates: c2008.
Call Number: O551.3-532/T441/2007

Book

10

Cover is for reference only

Thermal conductivity 27：thermal expansion 15 : joint conferences, October 26-29, 2003, Knoxville, Tennessee, USA

Corporate Authors: International Thermal Conductivity Conference (27th 2003 Knoxville, Tenn.); International Thermal Expansion Symposium 2003 Knoxville, Tenn.) (Knoxville, Tenn.)); Oak Ridge National Laboratory. High Temperature Materials Laboratory.
Group Author: Porter Wallace D.; Wang Hsin.
Published: DEStech Pub.,
Publication Dates: c2005.
Call Number: O551.3-532/T411/2003

Book

11

Cover is for reference only

Thermal conductivity 28：thermal expansion 16 : joint conferences : June 26-29, 2005, St. Andrews-by-the -Sea, New Brunswick, Canada

Corporate Authors: International Thermal Conductivity Conference (28th 2005 St. Andrews-by-the-Sea, New Brunswick, Canada); International Thermal Expansion Symposium 2005 St. Andrews-by-the-Sea, New Brunswick, Canada) (St. Andrews-by-the-Sea, New Brunswick, Canada)); Mathis Instruments.
Group Author: Dinwiddie Ralph B.
Published: DEStech Publications,
Publication Dates: c2006.
Call Number: O551.3-532/T441/2005

Book

Related Subjects