2021 International Conference on Simulation of Semiconductor Processes and Devices : (SISPAD 2021) : Dallas, Texas, USA, 27-29 September 2021.

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Bibliographic Details
Corporate Authors: International Conference on Simulation of Semiconductor Processes and Devices Dallas, Texas, USA); Institute of Electrical and Electronics Engineers.
Published: IEEE,
Publisher Address: Piscataway, NJ :
Publication Dates: [2021]
Literature type: Book
Language: English
Subjects:
Item Description: IEEE Catalog Number: CFP21SSD-POD.
ISSN: 1946-1569.
Carrier Form: 304 pages : illustrations ; 28 cm
Bibliography: Includes bibliographical references and author index.
ISBN: 9781665406864
CLC: TN305-532
Call Number: TN305-532/I61/2021