Systems engineering, electronics simulation, advanced electronics packaging, and electromagnetic compatibility.

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Bibliographic Details
Corporate Authors: Society of Automotive Engineers; SAE World Congress (2005 Detroit, Mich.)
Published: SAE International distributed by American Technical,
Publisher Address: Warrendale, Pa. Hitchin
Publication Dates: 2005.
Literature type: Book
Language: English
Series: SP Society of Automotive Engineers ; 1926
Subjects:
Carrier Form: 161 p.: ill. ; 28 cm.
ISBN: 0768015715 (pbk.)
Index Number: U464
CLC: U464.142-532
U464-532
Call Number: U464-532/S995/2005
Contents: Papers from a session of the SAE 2005 World Congress, Detroit, Mich.
Includes bibliographic references.