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Advances in CMP/polishing technologies for the manufacture of electronic devices /

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community.

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Bibliographic Details
Corporate Authors: Elsevier Science & Technology
Group Author: Doi, Toshiro; Marinescu, Ioan D; Kurokawa, Syuhei
Published: William Andrew,
Publisher Address: Oxford :
Publication Dates: 2012.
Literature type: eBook
Language: English
Edition: First edition.
Subjects:
Electrolytic polishing
Grinding and polishing
Electronic books
Online Access: http://www.sciencedirect.com/science/book/9781437778595
Summary: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community.
Item Description: Includes index.
Carrier Form: 1 online resource (xii, 317 pages)
ISBN: 9781437778595
1437778593
Index Number: TS670
CLC: TN204

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