2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits : (IPFA 2016) : Singapore, 18-21 July 2016.
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Corporate Authors: | ; |
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Published: |
IEEE,
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Publisher Address: | Piscataway, NJ : |
Publication Dates: | [2016] |
Literature type: | Book |
Language: | English |
Subjects: | |
Item Description: |
IEEE Catalog Number: CFP16777-POD. Includes bibliographical references. |
Carrier Form: | xxxix, 438 pages : illustrations ; 28 cm |
ISBN: | 9781467382601 |
CLC: | TN4-532 |
Call Number: | TN4-532/I61.6/2016 |