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2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits : (IPFA 2016) : Singapore, 18-21 July 2016.

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Bibliographic Details
Corporate Authors: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Singapore; Institute of Electrical and Electronic Engineers
Published: IEEE,
Publisher Address: Piscataway, NJ :
Publication Dates: [2016]
Literature type: Book
Language: English
Subjects:
Integrated circuits > Reliability > Congresses
Integrated circuits > Testing > Congresses
Semiconductors > Failures > Congresses
Integrated circuits > Defects > Congresses
Item Description: IEEE Catalog Number: CFP16777-POD.
Includes bibliographical references.
Carrier Form: xxxix, 438 pages : illustrations ; 28 cm
ISBN: 9781467382601
CLC: TN4-532
Call Number: TN4-532/I61.6/2016

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