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Proceedings of the 13th International Symposium on the Physical & Failure Analysis of Integrated Circuits：Singapore, 3-7 July 2006

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Bibliographic Details
Corporate Authors: International Symposium on the Physical & Failure Analysis of Integrated Circuits (13th 2006 Singapore; IEEE Reliability/CPMT/ED Singapore Chapter; IEEE Electron Devices Society
Group Author: Gan Chee Lip
Published: IEEE,
Publisher Address: Piscataway, N.J.
Publication Dates: 2006.
Literature type: Book
Language: English
Subjects:
Integrated circuits > Defects
Integrated circuits > Testing
Integrated circuits > Reliability
Carrier Form: viii, 355 p.: ill. ; 30 cm.
ISBN: 1424402050 (softbound ed.)
9781424402052 (softbound ed.)
Index Number: TN4
CLC: TN4-532
Call Number: TN4-532/I61.6/2006
Contents: "IEEE Catalog Number 06TH8872"--T.p. verso.
Includes bibliographical references and index.

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