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Advanced interconnects for ULSI technology

"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"--

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Bibliographic Details
Group Author: Baklanov, Mikhail; Ho, P. S; Zschech, Ehrenfried
Published:
Literature type: Electronic eBook
Language: English
Subjects:
Interconnects Integrated circuit technology
Integrated circuits > Ultra large scale integration
TECHNOLOGY & ENGINEERING > Electronics > Circuits > VLSI & ULSI
COMPUTERS > Logic Design
TECHNOLOGY & ENGINEERING > Electronics > Circuits > Logic
Electronic books
Online Access: http://onlinelibrary.wiley.com/book/10.1002/9781119963677
Summary: "This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"--
Carrier Form: 1 online resource.
Bibliography: Includes bibliographical references and index.
ISBN: 9781119963240 (electronic bk.)
1119963249 (electronic bk.)
9781119963677 (electronic bk.)
1119963672 (electronic bk.)
1280590807
9781280590801
Index Number: TK7874
CLC: TN47
Contents: Front Matter -- Colour Plates -- Section I: Low-. Low- Materials: Recent Advances / Geraud Dubois, Willi Volksen -- Ultra-Low- by CVD: Deposition and Curing / Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R Baklanov -- Plasma Processing of Low- Dielectrics / Hualiang Shi, Denis Shamiryan, Jean-Fraṅois de Marneffe, Huai Huang, Paul S Ho, Mikhail R Baklanov -- Wet Clean Applications in Porous Low- Patterning Processes / Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R Baklanov -- Section II: Conductive Layers and Barriers. Copper Electroplati

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