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1

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Stress management for 3D ICs using through silicon vias：International Workshop[s] on Stress Management for 3D ICs Using Through Silicon Vias, Albany, NY, U.S.A, March 16, 2010, San Francisco, CA, U.S.A., July 13, 2010, Dresden, Germany, October 20, 2010

Corporate Authors: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 Albany, N.Y; International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 Dresden, Germany); International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 San Francisco, Calif.)
Group Author: Zschech Ehrenfried
Published: American Institute of Physics,
Publication Dates: 2011.
Call Number: B849/I618/2010

Book

2

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Stress-induced phenomena in metallization：8th International Workshop on Stress-Induced Phenomena in Metallization, Dresden, Germany, 12-14 September 2005

Corporate Authors: International Workshop on Stress-Induced Phenomena in Metallization (8th 2005 Dresden, Germany)
Group Author: Zschech Ehrenfried.
Published: American Institute of Physics,
Publication Dates: 2006.
Call Number: TG172.9-532/S915/2005

Book

3

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Materials for information technology：devices, interconnects and packaging

Corporate Authors: Euromat 2003 (2003 Lausanne, Switzerland; Euromat 2003 (2003 Lausanne, Switzerland)
Group Author: Zschech Ehrenfried; Whelan Caroline; Mikolajick Thomas
Published: Springer,
Publication Dates: c2005.
Call Number: TN4-532/M425/2003

Book

4

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Materials for information technology：devices, interconnects and packaging

Corporate Authors: Euromat 2003 (2003 Lausanne, Switzerland)
Group Author: Zschech Ehrenfried.; Whelan Caroline.; Mikolajick Thomas.
Published: Springer,
Publication Dates: c2005.

Book

5

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Stress-induced phenomena in metallization：Eleventh International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 12-14 April 2010

Corporate Authors: International Workshop on Stress-Induced Phenomena in Metallization (11th 2010 Bad Schandau, Germany)
Group Author: Ho P. S.; Ogawa Shinichi, Dr.; Zschech Ehrenfried.
Published: American Institute of Physics,
Publication Dates: 2010.
Call Number: TG172.9-532/S915/2010

Book

6

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Stress-induced phenomena in metallization：Ninth International Workshop on Stress-Induced Phenomena in Metallization, Kyoto, Japan 4 - 6 April 2007

Corporate Authors: International Workshop on Stress-Induced Phenomena in Metallization (9th 2007 Kyoto, Japan)
Group Author: Ho P. S.; Zschech Ehrenfried.; Ogawa Shinʾichi.
Published: American Institute of Physics,
Publication Dates: ; 2007.
Call Number: TG172.9-532/S915/2007

Book

7

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Advanced interconnects for ULSI technology

Group Author: Baklanov Mikhail.; Ho P. S.; Zschech Ehrenfried.
Published: Wiley,
Publication Dates: 2012.
Call Number: TN47/A244

Book

8

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Stress-induced phenomena in metallization：Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 5-7 November 2008

Corporate Authors: International Workshop on Stress-Induced Phenomena in Metallization (10th 2008 Austin, Texas)
Group Author: Ogawa Shinʾichi.; Zschech Ehrenfried.; Ho P. S.
Published: American Institute of Physics,
Publication Dates: ; 2009.
Call Number: TG172.9-532/S915/2008

Book

9

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Advanced interconnects for ULSI technology

Group Author: Baklanov, Mikhail; Ho, P. S; Zschech, Ehrenfried
Published:

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