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Through silicon vias : materials, models, design, and performance /

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Bibliographic Details
Main Authors: Kaushik, Brajesh Kumar
Group Author: Kumar, Vobulapuram Ramesh; Majumder, Manoj Kumar; Alam, Arsalan
Published: CRC Press, Taylor & Francis Group,
Publisher Address: Boca Raton, FL :
Publication Dates: [2017]
Literature type: Book
Language: English
Subjects:
Interconnects Integrated circuit technology
Three-dimensional integrated circuits
Carrier Form: xv, 215 pages : illustrations, forms ; 24 cm
Bibliography: Includes bibliographical references and index.
ISBN: 9781498745529 (hardcover : alkaline paper) :
1498745520 (hardcover : alkaline paper)
Index Number: TK7874
CLC: TN43
Call Number: TN43/K217

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